3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
This paper deals with energy-aware real-time system scheduling using dynamic voltage scaling (DVS) for energy-constrained embedded systems that execute variable and unpredictable ...
With power density and hence cooling costs rising exponentially, processor packaging can no longer be designed for the worst case, and there is an urgent need for runtime processo...
Kevin Skadron, Mircea R. Stan, Wei Huang, Sivakuma...
Abstract-- We propose and evaluate User-Driven Frequency Scaling (UDFS) for improved power management on processors that support Dynamic Voltage and Frequency Scaling (DVFS), e.g, ...
Arindam Mallik, Bin Lin, Gokhan Memik, Peter A. Di...
New protocols for the data link and network layer are being proposed to address limitations of current protocols in terms of scalability, security, and manageability. High-speed r...
Lorenzo De Carli, Yi Pan, Amit Kumar, Cristian Est...