502 search results - page 90 / 101 » Evolving Hardware on a Large Scale |
IEEEPACT
2007
IEEE
14 years 4 months ago
2007
IEEE
Effective use of communication networks is critical to the performance and scalability of parallel applications. Partitioned Global Address Space languages like UPC bring the pro...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
ISCA
2005
IEEE
14 years 3 months ago
2005
IEEE
: The theoretical study of quantum computation has yielded efficient algorithms for some traditionally hard problems. Correspondingly, experimental work on the underlying physical...
ISCA
2005
IEEE
14 years 3 months ago
2005
IEEE
Memory latency tolerant architectures support thousands of in-flight instructions without scaling cyclecritical processor resources, and thousands of useful instructions can compl...
ISCA
2005
IEEE
14 years 3 months ago
2005
IEEE
Increased power densities (and resultant temperatures) and other effects of device scaling are predicted to cause significant lifetime reliability problems in the near future. In...