Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
This paper describes a new force directed global placement algorithm that exploits and extends techniques from two leading placers, Force-directed [12] [26] and Mongrel [22]. It c...
In this paper, we propose a Quantified Distributed Constraint Optimization problem (QDCOP) that extends the framework of Distributed Constraint Optimization problems (DCOPs). DCOP...
For national advisory services in the UK (UKOLN, CETIS, and OSS Watch), varieties of openness (open source software, open standards, and open access to research publications and d...
Many modern natural language processing applications would benefit from automatic morphological analysis of words, especially when dealing with morphologically rich languages. Con...