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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 3 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
DAC
2003
ACM
14 years 8 days ago
Force directed mongrel with physical net constraints
This paper describes a new force directed global placement algorithm that exploits and extends techniques from two leading placers, Force-directed [12] [26] and Mongrel [22]. It c...
Sung-Woo Hur, Tung Cao, Karthik Rajagopal, Yegna P...
ATAL
2010
Springer
13 years 8 months ago
A quantified distributed constraint optimization problem
In this paper, we propose a Quantified Distributed Constraint Optimization problem (QDCOP) that extends the framework of Distributed Constraint Optimization problems (DCOPs). DCOP...
Toshihiro Matsui, Hiroshi Matsuo, Marius-Calin Sil...
ELPUB
2007
ACM
13 years 11 months ago
Openness in Higher Education: Open Source, Open Standards, Open Access
For national advisory services in the UK (UKOLN, CETIS, and OSS Watch), varieties of openness (open source software, open standards, and open access to research publications and d...
Brian Kelly, Scott Wilson, Randy Metcalfe
CLEF
2008
Springer
13 years 8 months ago
Allomorfessor: Towards Unsupervised Morpheme Analysis
Many modern natural language processing applications would benefit from automatic morphological analysis of words, especially when dealing with morphologically rich languages. Con...
Oskar Kohonen, Sami Virpioja, Mikaela Klami