As technology evolves into the deep sub-micron era, signal integrity problems are growing into a major challenge. An important source of signal integrity problems is the crosstalk...
We have developed a generic integer linear programming(ILP)based engineering change(EC) methodology. The EC methodology has three components: enabling, fast, and preserving. Enabl...
Farinaz Koushanfar, Jennifer L. Wong, Jessica Feng...
In this paper, we describe a low power and high speed multiplier suitable for standard cell-based ASIC design methodologies. For the purpose, an optimized booth encoder, compact 2...
Ki-seon Cho, Jong-on Park, Jin-seok Hong, Goang-se...
Interconnect is one of the major concerns in current and future microprocessor designs from both performance and power consumption perspective. The emergence of three-dimensional ...
Balaji Vaidyanathan, Wei-Lun Hung, Feng Wang 0004,...
Abstract— Deep submicron technology scaling has two major ramifications on the design process. First, reduced feature size significantly increases wire delay, thus resulting in...