Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
Energy-efficient processor design is becoming more and more important with technology scaling and with high performance requirements. Supply-voltage scaling is an efficient way to...
Hai Li, Chen-Yong Cher, T. N. Vijaykumar, Kaushik ...
Numerical particle simulations and astronomical observations create huge data sets containing uncorrelated 3D points of varying size. These data sets cannot be visualized interact...
Clusters of workstations have emerged as an important platform for building cost-effective, scalable, and highlyavailable computers. Although many hardware solutions are available...
Eitan Frachtenberg, Fabrizio Petrini, Juan Fern&aa...