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DATE
2006
IEEE
152views Hardware» more  DATE 2006»
14 years 1 months ago
Adaptive chip-package thermal analysis for synthesis and design
Ever-increasing integrated circuit (IC) power densities and peak temperatures threaten reliability, performance, and economical cooling. To address these challenges, thermal analy...
Yonghong Yang, Zhenyu (Peter) Gu, Changyun Zhu, Li...
ISPD
2006
ACM
175views Hardware» more  ISPD 2006»
14 years 1 months ago
mPL6: enhanced multilevel mixed-size placement
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...
MICRO
2003
IEEE
143views Hardware» more  MICRO 2003»
14 years 28 days ago
VSV: L2-Miss-Driven Variable Supply-Voltage Scaling for Low Power
Energy-efficient processor design is becoming more and more important with technology scaling and with high performance requirements. Supply-voltage scaling is an efficient way to...
Hai Li, Chen-Yong Cher, T. N. Vijaykumar, Kaushik ...
VISUALIZATION
2003
IEEE
14 years 28 days ago
Hierarchical Splatting of Scattered Data
Numerical particle simulations and astronomical observations create huge data sets containing uncorrelated 3D points of varying size. These data sets cannot be visualized interact...
Matthias Hopf, Thomas Ertl
CLUSTER
2002
IEEE
14 years 19 days ago
Scalable Resource Management in High Performance Computers
Clusters of workstations have emerged as an important platform for building cost-effective, scalable, and highlyavailable computers. Although many hardware solutions are available...
Eitan Frachtenberg, Fabrizio Petrini, Juan Fern&aa...