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ICCAD
2006
IEEE
14 years 7 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
ICCAD
2005
IEEE
14 years 7 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
SOSP
2009
ACM
14 years 7 months ago
2009
ACM
Databases have achieved orders-of-magnitude performance improvements by changing the layout of stored data – for instance, by arranging data in columns or compressing it before ...
WWW
2010
ACM
14 years 5 months ago
2010
ACM
Twitter, a popular microblogging service, has received much attention recently. An important characteristic of Twitter is its real-time nature. For example, when an earthquake occ...
STACS
2010
Springer
14 years 5 months ago
2010
Springer
We revisit several maximization problems for geometric networks design under the non-crossing constraint, first studied by Alon, Rajagopalan and Suri (ACM Symposium on Computation...