2634 search results - page 427 / 527 » Faster Than Uppaal |
151
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ICCAD
2006
IEEE
16 years 3 months ago
2006
IEEE
With shrinking feature size and growing integration density in the Deep Sub-Micron technologies, the global buses are fast becoming the “weakest-links” in VLSI design. They ha...
162
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ICCAD
2005
IEEE
16 years 3 months ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
126
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SOSP
2009
ACM
16 years 2 months ago
2009
ACM
Databases have achieved orders-of-magnitude performance improvements by changing the layout of stored data – for instance, by arranging data in columns or compressing it before ...
180
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WWW
2010
ACM
16 years 1 months ago
2010
ACM
Twitter, a popular microblogging service, has received much attention recently. An important characteristic of Twitter is its real-time nature. For example, when an earthquake occ...
168
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STACS
2010
Springer
16 years 1 months ago
2010
Springer
We revisit several maximization problems for geometric networks design under the non-crossing constraint, first studied by Alon, Rajagopalan and Suri (ACM Symposium on Computation...