Abstract— To achieve small delay and low crosstalk for multiple signal nets with capacitive and inductive coupling, we propose in this paper a novel interconnect structure, stagg...
Recycling was recently proposed as a system-level design technique to facilitate the building of complex System-on-Chips (SOC) by assembling pre-designed components. Recycling all...
Luca P. Carloni, Alberto L. Sangiovanni-Vincentell...
This paper examines some models of FSMs that can be implemented in dynamically and statically reconfigurable FPGAs. They enable circuits for the FSMs to be constructed in such a wa...
In this paper, we for the rst time present experimental evidence that the die surface can act as an RC interconnect, becoming an important factor in determining the voltage of a o...
Advances in fabrication technology have resulted in a continual shrinkage of device dimensions. This has resulted in smaller device delays, greater resistance along interconnect w...