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TCAD
2002
135views more  TCAD 2002»
13 years 7 months ago
Area fill synthesis for uniform layout density
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
MICCAI
2009
Springer
14 years 8 months ago
Personalized Modeling and Assessment of the Aortic-Mitral Coupling from 4D TEE and CT
The anatomy, function and hemodynamics of the aortic and mitral valves are known to be strongly interconnected. An integrated quantitative and visual assessment of the aortic-mitra...
Razvan Ioan Ionasec, Ingmar Voigt, Bogdan George...
FCCM
2007
IEEE
111views VLSI» more  FCCM 2007»
14 years 2 months ago
A Structural Object Programming Model, Architecture, Chip and Tools for Reconfigurable Computing
A new platform for reconfigurable computing has an object-based programming model, with architecture, silicon and tools designed to faithfully realize this model. The platform is ...
Michael Butts, Anthony Mark Jones, Paul Wasson
CONEXT
2010
ACM
13 years 5 months ago
The Internet is flat: modeling the transition from a transit hierarchy to a peering mesh
Recent measurements and anecdotal evidence indicate that the Internet ecosystem is rapidly evolving from a multi-tier hierarchy built mostly with transit (customer-provider) links...
Amogh Dhamdhere, Constantine Dovrolis
ICCAD
2003
IEEE
122views Hardware» more  ICCAD 2003»
14 years 4 months ago
Weibull Based Analytical Waveform Model
Current CMOS technologies are characterized by interconnect lines with increased relative resistance w.r.t. driver output resistance. Designs generate signal waveshapes that are v...
Chirayu S. Amin, Florentin Dartu, Yehea I. Ismail