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» Hierarchical Interconnect Circuit Models
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ICCAD
2004
IEEE
138views Hardware» more  ICCAD 2004»
14 years 4 months ago
A thermal-driven floorplanning algorithm for 3D ICs
As the technology progresses, interconnect delays have become bottlenecks of chip performance. Three dimensional (3D) integrated circuits are proposed as one way to address this p...
Jason Cong, Jie Wei, Yan Zhang
TCAD
2002
137views more  TCAD 2002»
13 years 7 months ago
Generalized traveling-wave-based waveform approximation technique for the efficient signal integrity verification of multicouple
As very large scale integration (VLSI) circuit speed rapidly increases, the inductive effects of interconnect lines strongly impact the signal integrity of a circuit. Since these i...
Yungseon Eo, Seongkyun Shin, William R. Eisenstadt...
GLVLSI
1998
IEEE
169views VLSI» more  GLVLSI 1998»
13 years 12 months ago
On the Characterization of Multi-Point Nets in Electronic Designs
Important layout properties of electronic designs include interconnection length values, clock speed, area requirements, and power dissipation. A reliable estimation of those prop...
Dirk Stroobandt, Fadi J. Kurdahi
IEICET
2008
57views more  IEICET 2008»
13 years 7 months ago
Impact of Well Edge Proximity Effect on Timing
This paper studies impact of the well edge proximity effect on digital circuit delay, based on model parameters extracted from test structures in an industrial 65nm wafer process. ...
Toshiki Kanamoto, Yasuhiro Ogasahara, Keiko Natsum...
DAC
2004
ACM
14 years 8 months ago
STAC: statistical timing analysis with correlation
Current technology trends have led to the growing impact of both inter-die and intra-die process variations on circuit performance. While it is imperative to model parameter varia...
Jiayong Le, Xin Li, Lawrence T. Pileggi