537 search results - page 98 / 108 » High-precision interconnect analysis |
MR
2010
13 years 5 months ago
2010
Industrial applications often require failure analysis methods working non-destructively, enabling either a rapid quality control or fault isolation and defect localization prior ...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Most existing buffering algorithms neglect the impact of inductance on circuit performance, which causes large error in circuit analysis and optimization. Even for the approaches...
ICCAD
2006
IEEE
14 years 4 months ago
2006
IEEE
Electrostatic analysis of complicated molecular surfaces arises in a number of nanotechnology applications including: biomolecule design, carbon nanotube simulation, and molecular...
ICCAD
2003
IEEE
14 years 4 months ago
2003
IEEE
Placement is one of the most important steps in the RTLto-GDSII synthesis process, as it directly defines the interconnects, which have become the bottleneck in circuit and syste...
ISPD
2010
ACM
14 years 2 months ago
2010
ACM
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...