: Future nano scale devices will expose different characteristics than todays silicon devices. While the exponential growth of non recurring expenses (NRE, mostly due to mask sets)...
— As semiconductor processing techniques continue to scale down, transient faults, also known as soft errors, are increasingly becoming a reliability threat to high-performance m...
—Variations of process parameters have an important impact on reliability and yield in deep sub micron IC technologies. One methodology to estimate the influence of these effects...
This paper introduces an accurate analysis of on-chip inductance effects for distributed interconnects that takes the effect of both the series resistance and the output parasitic ...
Advancements in technology enable integration of a large number of cores on a single silicon die. At the same time, aggressive technology scaling has an ever-increasing adverse im...