2201 search results - page 287 / 441 » Improvement of ASIC Design Processes |
126
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CHI
2007
ACM
16 years 5 months ago
2007
ACM
Users gain access to cash, confidential information and services at Automated Teller Machines (ATMs) via an authentication process involving a Personal Identification Number (PIN)...
133
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ICCAD
2008
IEEE
16 years 1 months ago
2008
IEEE
— Three-dimensional die stacking integration provides the ability to stack multiple layers of processed silicon with a large number of vertical interconnects. Through Silicon Via...
144
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WWW
2010
ACM
15 years 11 months ago
2010
ACM
We introduce a client-server toolkit called Sync Kit that demonstrates how client-side database storage can improve the performance of data intensive websites. Sync Kit is designe...
139
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SC
2009
ACM
15 years 11 months ago
2009
ACM
Continuous evolution in process technology brings energyefficiency and reliability challenges, which are harder for memory system designs since chip multiprocessors demand high ba...
139
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DATE
2009
IEEE
15 years 11 months ago
2009
IEEE
—The sustained push for performance, transistor count, and instruction level parallelism has reached a point where chip level power density issues are at the forefront of design ...