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ICPADS
2006
IEEE
14 years 1 months ago
2006
IEEE
Congestion management is likely to become a critical issue in interconnection networks, as increasing power consumption and cost concerns will lead to the use of smaller networks....
DAC
2010
ACM
13 years 11 months ago
2010
ACM
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
JSAC
2006
13 years 7 months ago
2006
Distributed denial-of-service (DDoS) attacks pose a significant threat to the Internet. Most solutions proposed to-date face scalability problems as the size and speed of the netwo...
TWC
2008
13 years 7 months ago
2008
Abstract--Positioning in indoor wireless environments is growing rapidly in importance and gains commercial interests in context-awareness applications. The essential challenge in ...
TC
1998
13 years 7 months ago
1998
—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...