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» Improving yield and reliability of chip multiprocessors
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CODES
2007
IEEE
14 years 1 months ago
Three-dimensional multiprocessor system-on-chip thermal optimization
3D stacked wafer integration has the potential to improve multiprocessor system-on-chip (MPSoC) integration density, performance, and power efficiency. However, the power density...
Chong Sun, Li Shang, Robert P. Dick
ISHPC
2003
Springer
14 years 24 days ago
Performance Study of a Whole Genome Comparison Tool on a Hyper-Threading Multiprocessor
We developed a multithreaded parallel implementation of a sequence alignment algorithm that is able to align whole genomes with reliable output and reasonable cost. This paper pres...
Juan del Cuvillo, Xinmin Tian, Guang R. Gao, Milin...
DAC
2006
ACM
13 years 9 months ago
A fast HW/SW FPGA-based thermal emulation framework for multi-processor system-on-chip
With the growing complexity in consumer embedded products and the improvements in process technology, Multi-Processor SystemOn-Chip (MPSoC) architectures have become widespread. T...
David Atienza, Pablo Garcia Del Valle, Giacomo Pac...
TC
1998
13 years 7 months ago
Methodologies for Tolerating Cell and Interconnect Faults in FPGAs
—The very high levels of integration and submicron device sizes used in current and emerging VLSI technologies for FPGAs lead to higher occurrences of defects and operational fau...
Fran Hanchek, Shantanu Dutt
ISLPED
2009
ACM
123views Hardware» more  ISLPED 2009»
14 years 8 days ago
Predict and act: dynamic thermal management for multi-core processors
In this paper, we propose a proactive dynamic thermal management scheme for chip multiprocessors that run multi-threaded workloads. We introduce a new predictor that utilizes the ...
Raid Zuhair Ayoub, Tajana Simunic Rosing