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ICCAD
2005
IEEE
118views Hardware» more  ICCAD 2005»
14 years 5 months ago
Thermal via planning for 3-D ICs
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
Jason Cong, Yan Zhang
CCS
2011
ACM
12 years 8 months ago
Policy auditing over incomplete logs: theory, implementation and applications
We present the design, implementation and evaluation of an algorithm that checks audit logs for compliance with privacy and security policies. The algorithm, which we name reduce,...
Deepak Garg, Limin Jia, Anupam Datta
BMCBI
2007
110views more  BMCBI 2007»
13 years 8 months ago
Selection of long oligonucleotides for gene expression microarrays using weighted rank-sum strategy
Background: The design of long oligonucleotides for spotted DNA microarrays requires detailed attention to ensure their optimal performance in the hybridization process. The main ...
Guangan Hu, Manuel Llinás, Jingguang Li, Pe...
ATAL
2008
Springer
13 years 10 months ago
Using organization knowledge to improve routing performance in wireless multi-agent networks
Multi-agent systems benefit greatly from an organization design that guides agents in determining when to communicate, how often, with whom, with what priority, and so on. However...
Huzaifa Zafar, Victor R. Lesser, Daniel D. Corkill...
ISSTA
2004
ACM
14 years 2 months ago
Model checking XML manipulating software
The use of XML as the de facto data exchange standard has allowed integration of heterogeneous web based software systems regardless of implementation platforms and programming la...
Xiang Fu, Tevfik Bultan, Jianwen Su