The flip-chip package provides a high chip-density solution to the demand for more I/O pads of VLSI designs. In this paper, we present the first routing algorithm in the literatur...
Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best pow...
Ruchir Puri, Leon Stok, John M. Cohn, David S. Kun...
As a prevalent constraint, sharp slew rate is often required in circuit design which causes a huge demand for buffering resources. This problem requires ultra-fast buffering techn...
Shiyan Hu, Charles J. Alpert, Jiang Hu, Shrirang K...
Field programmable dual-Vdd interconnects are effective to reduce FPGA power. Assuming uniform length interconnects, existing work has developed time slack budgeting to minimize p...
Design principles for XML schemas that eliminate redundancies and avoid update anomalies have been studied recently. Several normal forms, generalizing those for relational databa...