1928 search results - page 350 / 386 » Integrity Constraints in OWL |
ICCD
2002
IEEE
14 years 6 months ago
2002
IEEE
The requirements to system and software development tools brought up by the automotive industry differ from the requirements that other customers have. The important catchwords he...
DATE
2009
IEEE
14 years 4 months ago
2009
IEEE
Abstract—While prior research has extensively evaluated the performance advantage of moving from a 2D to a 3D design style, the impact of process parameter variations on 3D desig...
SACMAT
2009
ACM
14 years 4 months ago
2009
ACM
A number of research systems have demonstrated the benefits of accompanying each request with a machine-checkable proof that the request complies with access-control policy — a...
HOTI
2008
IEEE
14 years 4 months ago
2008
IEEE
Buses have historically provided a flexible communications structure in computer systems. However, signal integrity constraints of high-speed electronics have made multi-drop elec...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...