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» Interconnect design for deep submicron ICs
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ICCAD
2000
IEEE
148views Hardware» more  ICCAD 2000»
13 years 11 months ago
Coupling-Driven Signal Encoding Scheme for Low-Power Interface Design
Coupling effects between on-chip interconnects must be addressed in ultra deep submicron VLSI and system-on-a-chip (SoC) designs. A new low-power bus encoding scheme is proposed t...
Ki-Wook Kim, Kwang-Hyun Baek, Naresh R. Shanbhag, ...
IOLTS
2003
IEEE
133views Hardware» more  IOLTS 2003»
13 years 12 months ago
Power Consumption of Fault Tolerant Codes: the Active Elements
On-chip global interconnections in very deep submicron technology (VDSM) ICs are becoming more sensitive and prone to errors caused by power supply noise, crosstalk noise, delay v...
Daniele Rossi, Steven V. E. S. van Dijk, Richard P...
DAC
1999
ACM
13 years 11 months ago
A Floorplan-Based Planning Methodology for Power and Clock Distribution in ASICs
In deep submicron technology, IR-drop and clock skew issues become more crucial to the functionality of chip. This paper presents a oorplan-based power and clock distribution meth...
Joon-Seo Yim, Seong-Ok Bae, Chong-Min Kyung
TC
2008
13 years 6 months ago
Adaptive Channel Buffers in On-Chip Interconnection Networks - A Power and Performance Analysis
On-chip interconnection networks (OCINs) have emerged as a modular and scalable solution for wire delay constraints in deep submicron VLSI design. OCIN research has shown that the ...
Avinash Karanth Kodi, Ashwini Sarathy, Ahmed Louri
SLIP
2003
ACM
13 years 12 months ago
A hierarchical three-way interconnect architecture for hexagonal processors
The problem of interconnect architecture arises when an array of processors needs to be integrated on one chip. With the deep sub-micron technology, devices become cheap while wir...
Feng Zhou, Esther Y. Cheng, Bo Yao, Chung-Kuan Che...