731 search results - page 10 / 147 » Interconnect modeling for improved system-level design optim... |
GECCO
2007
Springer
14 years 1 months ago
2007
Springer
Some auxiliary systems of next generation naval ships will utilize distributed automatic control. Such distributed control systems will use interconnected sensors, actuators, cont...
VLSID
2002
IEEE
14 years 8 months ago
2002
IEEE
The improved T and improved n models are proposed for onchip interconnect macromodeling. Using global approximations, simple approximation frames are derived and applied to modeli...
SLIP
2009
ACM
14 years 2 months ago
2009
ACM
Individual dies in 3D integrated circuits are connected using throughsilicon-vias (TSVs). TSVs not only increase manufacturing cost, but also incur silicon area, delay, and power ...
ISVLSI
2005
IEEE
14 years 1 months ago
2005
IEEE
Mesh interconnect can be efficiently utilized while tree networks encourage the short routing distances. In this paper, we present the property analysis of a cluster-based interc...
MICRO
2007
IEEE
14 years 1 months ago
2007
IEEE
A significant part of future microprocessor real estate will be dedicated to L2 or L3 caches. These on-chip caches will heavily impact processor performance, power dissipation, a...