731 search results - page 17 / 147 » Interconnect modeling for improved system-level design optim... |
ICCD
2007
IEEE
14 years 4 months ago
2007
IEEE
Most previous 3D IC research focused on “stacking” traditional 2D silicon layers, so the interconnect reduction is limited to interblock delays. In this paper, we propose tech...
IPPS
2009
IEEE
14 years 2 months ago
2009
IEEE
The increasing demand for computational cycles is being met by the use of multi-core processors. Having large number of cores per node necessitates multi-core aware designs to ext...
ASIAMS
2007
IEEE
14 years 1 months ago
2007
IEEE
Simulation is perhaps the most cost-effective tool to evaluate the operation of a system under design. A flexible, easy to extend, fully object-oriented, and multilayered simulato...
ASPDAC
2007
ACM
13 years 11 months ago
2007
ACM
- For modern processor designs in nanometer technologies, both block and interconnect pipelining are needed to achieve multi-gigahertz clock frequency, but previous approaches cons...
TVLSI
2002
13 years 7 months ago
2002
Abstract--This paper provides a high level survey of the increasing effects of on-chip inductance. These effects are classified into desirable and nondesirable effects. Among the u...