17 search results - page 2 / 4 » Interconnect opportunities for gigascale integration |
ASPDAC
2011
ACM
12 years 11 months ago
2011
ACM
3-D monolithic integration (3DMI), also termed as sequential integration, is a potential technology for future gigascale circuits. Since the device layers are processed in sequent...
CAMP
2005
IEEE
14 years 1 months ago
2005
IEEE
Abstract— Robot vision systems notoriously require large computing capabilities, rarely available on physical devices. Robots have limited embedded hardware, and almost all senso...
NOCS
2009
IEEE
14 years 2 months ago
2009
IEEE
Communication plays a crucial role in the design and performance of multi-core systems-on-chip (SoCs). Networks-on-chip (NoCs) have been proposed as a promising solution to simpli...
DATE
2008
IEEE
14 years 1 months ago
2008
IEEE
Extending 2-D planar topologies in integrated circuits (ICs) to a 3-D implementation has the obvious benefits of reducing the overall footprint and average interconnection length,...
ISCA
2008
IEEE
14 years 1 months ago
2008
IEEE
Recently, Network-on-Chip (NoC) architectures have gained popularity to address the interconnect delay problem for designing CMP / multi-core / SoC systems in deep sub-micron tech...