108 search results - page 18 / 22 » Introspective 3D chips |
EH
2003
IEEE
14 years 26 days ago
2003
IEEE
This paper presents a new approach to reversible cascade evolution based on a 3D cellular automaton. As a research platform we used the ATR’s CAMBrain Machine (CBM). Reversible ...
ICCD
2008
IEEE
14 years 4 months ago
2008
IEEE
— The increasing viability of three dimensional (3D) silicon integration technology has opened new opportunities for chip architecture innovations. One direction is in the extens...
ISCA
2009
IEEE
14 years 2 months ago
2009
IEEE
Caching techniques have been an efficient mechanism for mitigating the effects of the processor-memory speed gap. Traditional multi-level SRAM-based cache hierarchies, especially...
DATE
2006
IEEE
14 years 1 months ago
2006
IEEE
: In this research, a fixed-point multimedia co-processor is designed and tested into an ARM-10 based mobile graphics processor for portable 2-D and 3-D multimedia applications. Th...
ISCA
2000
IEEE
13 years 12 months ago
2000
IEEE
The bandwidth and latency of a memory system are strongly dependent on the manner in which accesses interact with the “3-D” structure of banks, rows, and columns characteristi...