While the number of transistors on a chip increases exponentially over time, the productivity that can be realized from these systems has not kept pace. To deal with the complexit...
Abstract— Three-dimensional (3D) integration and Networkon-Chip (NoC) are both proposed to tackle the on-chip interconnect scaling problems, and extensive research efforts have b...
Three-dimensional ICs promise to significantly extend the scale of system integration and facilitate new-generation electronics. However, progress in commercial 3D ICs has been s...
Three-dimensional integrated circuits are a promising approach to address the integration challenges faced by current Systems on Chips (SoCs). Designing an efficient Network on C...
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...