108 search results - page 4 / 22 » Introspective 3D chips |
INTEGRATION
2010
13 years 6 months ago
2010
ASPDAC
2010
ACM
13 years 5 months ago
2010
ACM
TPDS
2010
13 years 6 months ago
2010
Abstract—A rising horizon in chip fabrication is the 3D integration technology. It stacks two or more dies vertically with a dense, highspeed interface to increase the device den...
DATE
2007
IEEE
14 years 1 months ago
2007
IEEE
3D integration of multiple active layers into a single chip is a viable technique that greatly reduces the length of global wires by providing vertical connections between layers....
3DIC
2009
IEEE
14 years 20 days ago
2009
IEEE
- In this paper, an electrical-thermal co-analysis method for power delivery networks in 3D system integration is proposed. For electrical analysis, temperature-dependent electrica...