level of accuracy in IC package abstraction (compact models) to ensure robust thermal design. An overarching goal must be to reduce power consumption per function through smart pro...
Ruchir Puri, Devadas Varma, Darvin Edwards, Alan J...
- In this paper, we propose a thermal-aware job allocation and scheduling algorithm for three-dimensional (3D) chip multiprocessor (CMP). The proposed algorithm assigns hot jobs to...
—Packaging becomes an important issue in aerospace equipments because of high integration and severe environmental constraints. In order to develop products which respond to the ...
In temperature-aware design, the presence or absence of a heatsink fundamentally changes the thermal behavior with important design implications. In recent years, chip-level infra...
Wei Huang, Kevin Skadron, Sudhanva Gurumurthi, Rob...
Thermal management is critical for integrated circuit (IC) design. With each new IC technology generation, feature sizes decrease, while operating speeds and package densities incr...
Philip Y. Paik, Vamsee K. Pamula, Krishnendu Chakr...