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ICCD
2005
IEEE
131views Hardware» more  ICCD 2005»
14 years 6 months ago
A Flexible Design Methodology for Analog Test Wrappers in Mixed-Signal SOCs
The manufacturing test cost for mixed-signal SOCs is widely recognized to be much higher than that for digital SOCs. It has been shown in recent prior work that the use of analog ...
Anuja Sehgal, Sule Ozev, Krishnendu Chakrabarty
ICCD
2004
IEEE
107views Hardware» more  ICCD 2004»
14 years 6 months ago
Network-on-Chip: The Intelligence is in The Wire
In this paper we describe how Network-on-Chip (NoC) will be the next major challenge to implementing complex and function-rich applications in advanced manufacturing processes at ...
Gérard Mas, Philippe Martin
ICCD
2003
IEEE
147views Hardware» more  ICCD 2003»
14 years 6 months ago
Design Flow Enhancements for DNA Arrays
DNA probe arrays have recently emerged as one of the core genomic technologies. Exploiting analogies between manufacturing processes for DNA arrays and for VLSI chips, we demonstr...
Andrew B. Kahng, Ion I. Mandoiu, Sherief Reda, Xu ...
ICCD
2003
IEEE
141views Hardware» more  ICCD 2003»
14 years 6 months ago
Structured ASICs: Opportunities and Challenges
There is currently a huge gap between the two main technologies used to implement custom digital integrated circuit (IC) designs. At one end of the spectrum are field programmable...
Behrooz Zahiri
ICCAD
2008
IEEE
106views Hardware» more  ICCAD 2008»
14 years 5 months ago
Process variability-aware transient fault modeling and analysis
– Due to reduction in device feature size and supply voltage, the sensitivity of digital systems to transient faults is increasing dramatically. As technology scales further, the...
Natasa Miskov-Zivanov, Kai-Chiang Wu, Diana Marcul...