1295 search results - page 196 / 259 » Layered manufacturing technologies |
ICCD
2005
IEEE
14 years 5 months ago
2005
IEEE
Abstract— Noise induced by impedance discontinuities from VLSI packaging is one of the leading challenges facing system level designers in the next decade. The performance of IC ...
ISORC
2009
IEEE
14 years 3 months ago
2009
IEEE
AUTOSAR as specified in its current version fosters timing-constraints at application level to support the development of real-time automotive applications. However, the standard...
ICST
2008
IEEE
14 years 3 months ago
2008
IEEE
In recent years the development of automotive embedded devices has changed from an electrical and mechanical engineering discipline to a combination of software and electrical/mec...
DATE
2007
IEEE
14 years 3 months ago
2007
IEEE
Everybody agrees that curing DFM/DFY issues is of paramount importance at 65 nanometers and beyond. Unfortunately, there is disagreement about how and when to cure them. “Surgeo...
RTAS
2007
IEEE
14 years 3 months ago
2007
IEEE
It is challenging to manage the performance of real-time databases (RTDBs) that are often used in data-intensive real-time applications such as agile manufacturing and target trac...