Sciweavers

1295 search results - page 199 / 259
» Layered manufacturing technologies
Sort
View
ITC
2003
IEEE
148views Hardware» more  ITC 2003»
14 years 2 months ago
HyAC: A Hybrid Structural SAT Based ATPG for Crosstalk
As technology evolves into the deep sub-micron era, signal integrity problems are growing into a major challenge. An important source of signal integrity problems is the crosstalk...
Xiaoliang Bai, Sujit Dey, Angela Krstic
MICRO
2003
IEEE
109views Hardware» more  MICRO 2003»
14 years 2 months ago
TLC: Transmission Line Caches
It is widely accepted that the disproportionate scaling of transistor and conventional on-chip interconnect performance presents a major barrier to future high performance systems...
Bradford M. Beckmann, David A. Wood
EVOW
2001
Springer
14 years 1 months ago
ARPIA: A High-Level Evolutionary Test Signal Generator
The integrated circuits design flow is rapidly moving towards higher description levels. However, test-related activities are lacking behind this trend, mainly since effective faul...
Fulvio Corno, Gianluca Cumani, Matteo Sonza Reorda...
SIGGRAPH
2010
ACM
14 years 1 months ago
Paneling architectural freeform surfaces
The emergence of large-scale freeform shapes in architecture poses big challenges to the fabrication of such structures. A key problem is the approximation of the design surface b...
Michael Eigensatz, Martin Kilian, Alexander Schift...
ISRR
2001
Springer
165views Robotics» more  ISRR 2001»
14 years 1 months ago
Human-Centered Robotics and Interactive Haptic Simulation
A new field of robotics is emerging. Robots are today moving towards applications beyond the structured environment of a manufacturing plant. They are making their way into the e...
Oussama Khatib, Oliver Brock, K. C. Chang, Diego C...