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NANONET
2009
Springer
199views Chemistry» more  NANONET 2009»
14 years 2 days ago
Through Silicon Via-Based Grid for Thermal Control in 3D Chips
3D stacked chips have become a promising integration technology for modern systems. The complexity reached in multi-processor systems has increased the communication delays between...
José L. Ayala, Arvind Sridhar, Vinod Pangra...
IFIP
1997
Springer
13 years 11 months ago
A simulation model for designing the automation of future's factory
The factory of the future is going to have a high, but not full, degree of automation. There are three reasons for that. First, no great level of automation is compatible with req...
Javier Borda Elejabarrieta
FOMI
2008
13 years 9 months ago
IPAS ontology development
There is a trend in some manufacturing industries to move from selling products to providing services. As a result, designers must consider the life-cycle costs. In the aero indust...
David W. Fowler, Quentin Reul, Derek H. Sleeman
IFIP
1998
Springer
13 years 11 months ago
Mobile agent technology in support of sales order processing in the virtual enterprise
The flexible integration of a range of disparate IT applications is a key requirement for today's global enterprises. The virtual enterprise, formed by a collection of collab...
Todd Papaioannou, John Edwards
ISLPED
1996
ACM
93views Hardware» more  ISLPED 1996»
13 years 11 months ago
250-600 Mhz 12b digital filters in 0.8-0.25um Bulk and SOI CMOS technologies
This paper describes a family of high-speed Finite Impulse Response (FIR) digital filters that have been scaled across three generations of CMOS processes. The processes include c...
Lars E. Thon, Ghavam G. Shahidi, Werner Rausch, Ge...