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ISPD
1998
ACM
89views Hardware» more  ISPD 1998»
14 years 1 months ago
Filling and slotting: analysis and algorithms
In very deep-submicron VLSI, certain manufacturing steps – notably optical exposure, resist development and etch, chemical vapor deposition and chemical-mechanical polishing (CM...
Andrew B. Kahng, Gabriel Robins, Anish Singh, Huij...
ICC
2009
IEEE
185views Communications» more  ICC 2009»
14 years 4 months ago
On the Security Performance of Physical-Layer Network Coding
—Physical-layer network coding (PLNC) is a novel wireless communication technology, in which multiple transmitters can send signals on the same channel to the same receiver at th...
Kejie Lu, Shengli Fu, Yi Qian, Tao Zhang
ICCAD
2008
IEEE
170views Hardware» more  ICCAD 2008»
14 years 6 months ago
A polynomial time approximation scheme for timing constrained minimum cost layer assignment
Abstract— As VLSI technology enters the nanoscale regime, interconnect delay becomes the bottleneck of circuit performance. Compared to gate delays, wires are becoming increasing...
Shiyan Hu, Zhuo Li, Charles J. Alpert
DAC
2000
ACM
14 years 10 months ago
Multiple Si layer ICs: motivation, performance analysis, and design implications
Continuous scaling of VLSI circuits is reducing gate delays but rapidly increasing interconnect delays. Semiconductor Industry Association (SIA) roadmap predicts that, beyond the ...
Shukri J. Souri, Kaustav Banerjee, Amit Mehrotra, ...
ASPDAC
2008
ACM
103views Hardware» more  ASPDAC 2008»
13 years 11 months ago
Reliability-aware design for nanometer-scale devices
Continuous transistor scaling due to improvements in CMOS devices and manufacturing technologies is increasing processor power densities and temperatures; thus, creating challenges...
David Atienza, Giovanni De Micheli, Luca Benini, J...