—Pre-bond testing of 3-D stacked integrated circuits (ICs) involves testing each individual die before bonding. The overall yield of 3-D ICs improves with pre-bond testability be...
Xin Zhao, Dean L. Lewis, Hsien-Hsin S. Lee, Sung K...
A recent trend in low power design has been the employment of reduced precision processing methods for decreasing arithmetic activity and average power dissipation. Such designs c...
In this paper, we introduce the use of slow-silent virtual channels to reduce the switching power of on-chip networks while keeping the leakage power small. Adding virtual channel...
I n this paper, we first present a pipelined delayed least mean square (DLMS) adaptive filter architecture whose power dissipation meets a specified budget. This low-power archite...
An evolutionary algorithm is used to design a finite impulse response digital filter with reduced power consumption. The proposed design approach combines genetic optimization an...