26 search results - page 4 / 6 » MCM placement using a realistic thermal model |
ICCS
2003
Springer
14 years 25 days ago
2003
Springer
The Earth’s tectonic plates are strong, viscoelastic shells which make up the outermost part of a thermally convecting, predominantly viscous layer; at the boundaries between pla...
ICCAD
2004
IEEE
14 years 4 months ago
2004
IEEE
We address the classic wire-length estimation problem and propose a new statistical wire-length estimation approach that captures the probability distribution function of net leng...
FPL
2006
Springer
13 years 11 months ago
2006
Springer
We discuss the problem of communication-aware module placement in array-like reconfigurable environments, such as the Erlangen Slot Machine (ESM). Bad placement of modules may deg...
TVLSI
2002
13 years 7 months ago
2002
Switching activity-generated power-supply grid-noise presents a major obstacle to the reduction of supply voltage in future generation semiconductor technologies. A popular techniq...
ICCAD
2007
IEEE
14 years 4 months ago
2007
IEEE
Abstract— Thermal issues are a primary concern in the threedimensional (3D) integrated circuit (IC) design. Temperature, area, and wire length must be simultaneously optimized du...