2749 search results - page 416 / 550 » Manufacturing-Aware Physical Design |
ISLPED
2005
ACM
14 years 2 months ago
2005
ACM
Temperature is becoming a first rate design criterion in ASICs due to its negative impact on leakage power, reliability, performance, and packaging cost. Incorporating awareness o...
ISPD
2005
ACM
14 years 2 months ago
2005
ACM
Modern advances in reconfigurable analog technologies are allowing field-programmable analog arrays (FPAAs) to dramatically grow in size, flexibility, and usefulness. With thes...
OZCHI
2005
ACM
14 years 2 months ago
2005
ACM
This paper describes research into the personalised delivery of information about an intelligent environment. The challenges we need to address are the dual forms of the Invisibili...
GLVLSI
2003
IEEE
14 years 2 months ago
2003
IEEE
We propose an approach for reducing the energy consumption of address buses that targets both the switching and the crosstalk components of power dissipation. The method is based ...
ISCAS
2003
IEEE
14 years 2 months ago
2003
IEEE
Higher transistor transition frequencies, lower supply voltages and smaller physical dimensions are, nowadays, general trends in the semiconductor industry. Operating at lower sup...