4880 search results - page 964 / 976 » Mechanism Design by Creditability |
TPDS
1998
13 years 8 months ago
1998
—Three-dimensional packaging technologies are critical for enabling ultra-compact, massively parallel processors (MPPs) for embedded applications. Through-wafer optical interconn...
PR
2007
13 years 8 months ago
2007
We previously presented an image registration method, referred to hierarchical attribute matching mechanism for elastic registration (HAMMER), which demonstrated relatively high a...
TON
2008
13 years 8 months ago
2008
Significant progress has been made towards making ad hoc networks secure and DoS resilient. However, little attention has been focused on quantifying DoS resilience: Do ad hoc netw...
COMPSEC
2010
13 years 7 months ago
2010
Making backup is so cumbersome and expensive that individuals hardly ever backup their data and companies usually duplicate their data into a secondary server. This paper proposes...
DSD
2010
IEEE
13 years 7 months ago
2010
IEEE
— Chip Multiprocessor (CMP) systems have become the reference architecture for designing micro-processors, thanks to the improvements in semiconductor nanotechnology that have co...