12 search results - page 3 / 3 » Microarchitecture level power and thermal simulation conside... |
ISCAS
2007
IEEE
14 years 1 months ago
2007
IEEE
— Scaling of CMOS technologies has led to dramatic increase in sub-threshold, gate and reverse biased junction band-to-band-tunneling (BTBT) leakage. Leakage current has now beco...
VLSID
2010
IEEE
13 years 5 months ago
2010
IEEE
Due to the inherent nature of heat flow in 3D integrated circuits, stacked dies exhibit a wide range of thermal characteristics. The strong dependence of leakage with temperature...