137 search results - page 15 / 28 » Minimizing power across multiple technology and design level... |
CISS
2008
IEEE
14 years 1 months ago
2008
IEEE
—We consider a wireless node that randomly receives data from different sensor units. The arriving data must be compressed, stored, and transmitted over a wireless link, where bo...
TWC
2008
13 years 7 months ago
2008
Abstract-- In many portable devices, wireless network interfaces consume upwards of 30% of scarce system energy. Reducing the transceiver's power consumption to extend the sys...
DATE
2004
IEEE
13 years 11 months ago
2004
IEEE
In this paper, we present various challenges that arise in the delivery and exchange of multimedia information to mobile devices. Specifically, we focus on techniques for maintain...
EUROPAR
2003
Springer
14 years 21 days ago
2003
Springer
In this paper, a two-dimensional airfoil shape optimisation problem is investigated using CFD within a grid computing environment (GCE) implemented in Matlab. The feature-based par...
MICRO
2006
IEEE
14 years 1 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...