Particle compound material is the composition of different particles with inhomogeneous and non-uniform properties. Particle compound material is the most complicated engineering m...
As the geometry shrinking faces severe limitations, 3D wafer stacking with through silicon via (TSV) has gained interest for future SOC integration. Since TSV fill material and s...
Genetic algorithms (GAs) have been applied previously to UML-driven, stress test requirements generation with the aim of increasing chances of discovering faults relating to networ...
Starting from the 90nm technology node, process induced stress has played a key role in the design of highperformance devices. The emergence of source/drain silicon germanium (S/D ...
Traditional vector-based models use word co-occurrence counts from large corpora to represent lexical meaning. In this paper we present a novel approach for constructing semantic ...