2609 search results - page 419 / 522 » Models for Global Constraint Applications |
134
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ICCAD
2005
IEEE
16 years 19 days ago
2005
IEEE
Heat dissipation is one of the most serious challenges in 3D IC designs. One effective way of reducing circuit temperature is to introduce thermal through-the-silicon (TTS) vias....
142
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CBSE
2004
Springer
15 years 9 months ago
2004
Springer
According to Szyperski, “a software component is a unit of composition with contractually specified interfaces and explicit context dependencies only”. But it is well known tha...
93
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ASPDAC
2000
ACM
15 years 8 months ago
2000
ACM
Many intellectual property protection (IPP) techniques have been proposed. Their primary objectives are providing convincible proof of authorship with least degradation of the qua...
147
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CDC
2009
IEEE
15 years 4 months ago
2009
IEEE
We consider the problem of selecting a subset of p out of n sensors for the purpose of event detection, in a wireless sensor network (WSN). Occurrence or not of the event of intere...
153
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ECCV
2004
Springer
16 years 5 months ago
2004
Springer
In this paper, we present a vision system for object recognition in aerial images, which enables broader mission profiles for Micro Air Vehicles (MAVs). The most important factors ...