—Systems on chip are more and more heterogeneous and include software, analog/RF and digital hardware, and non-electronic components such as sensors or actuators. The design and ...
Within-die process variations arise during integrated circuit (IC) fabrication in the sub-100nm regime. These variations are of paramount concern as they deviate the performance of...
In this paper we present a generic interconnect fabric for transaction level modelling tackeling three major aspects. First, a review of the bus and IO structures that we have ana...
Abstract. Most of the new embedded systems require high performance processors at low power. To cater to these needs, most semiconductor companies are designing multi-core processo...
We present a performance-oriented refinement approach that refines a perfectly synchronous communication model onto Network-on-Chip (NoC) communication. We first identify four bas...