One of the greatest impediments to achieving high quality placements using force-directed methods lies in the large amount of overlap initially present in these techniques. This o...
As the technology node progresses, thermal problems are becoming more prominent especially in the developing technology of three-dimensional (3D) integrated circuits. The thermal ...
This paper describes a new force directed global placement algorithm that exploits and extends techniques from two leading placers, Force-directed [12] [26] and Mongrel [22]. It c...
Automatic circuit placement has received renewed interest recently given the rapid increase of circuit complexity, increase of interconnect delay, and potential sub-optimality of ...
The multilevel placement package mPL6 combines improved implementations of the global placer mPL5 (ISPD05) and the XDP legalizer and detailed placer (ASPDAC06). It consistently pr...
Tony F. Chan, Jason Cong, Joseph R. Shinnerl, Kent...