56 search results - page 5 / 12 » Multilevel generalized force-directed method for circuit pla... |
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
DAC
2011
ACM
12 years 7 months ago
2011
ACM
Existing thermal-aware 3D placement methods assume that the temperature of 3D ICs can be optimized by properly distributing the power dissipations, and ignoring the heat conductiv...
ISPD
2007
ACM
13 years 9 months ago
2007
ACM
In this paper, we derive the X-half-perimeter wirelength (XHPWL) model for X-architecture placement and explore the effects of three different wire models on X-architecture plac...
ISPD
2006
ACM
14 years 1 months ago
2006
ACM
Linear programming (LP) based methods are attractive for solving the placement problem because of their ability to model Half-Perimeter Wirelength (HPWL) and timing. However, it h...
ISPD
2005
ACM
14 years 1 months ago
2005
ACM
As thermal problems become more evident, new physical design paradigms and tools are needed to alleviate them. Incorporating thermal vias into integrated circuits (ICs) is a promi...