1441 search results - page 249 / 289 » Multiple instance ranking |
SAMOS
2007
Springer
14 years 3 months ago
2007
Springer
—This paper presents a new methodology based on evolutionary multi-objective optimization (EMO) to synthesize multiple complex modules on programmable devices (FPGAs). It starts ...
INFOCOM
2006
IEEE
14 years 3 months ago
2006
IEEE
— We study the complexity of a spectrum of design problems for optical networks in order to carry a set of demands. Under wavelength division multiplexing (WDM) technology, deman...
MICRO
2006
IEEE
14 years 3 months ago
2006
IEEE
3D die stacking is an exciting new technology that increases transistor density by vertically integrating two or more die with a dense, high-speed interface. The result of 3D die ...
SIGCOMM
2006
ACM
14 years 3 months ago
2006
ACM
In a wireless sensor network of N nodes transmitting data to a single base station, possibly over multiple hops, what distributed mechanisms should be implemented in order to dyna...
ICCD
2005
IEEE
14 years 3 months ago
2005
IEEE
Nanoelectronic devices are expected to have extremely high and variable fault rates; thus future processor architectures based on these unreliable devices need to be built with fa...