77 search results - page 7 / 16 » Network-on-chip link analysis under power and performance co... |
GLOBECOM
2007
IEEE
14 years 1 months ago
2007
IEEE
— We consider about a multiple relay system operating under amplify-and-forward (AF) protocol and non-coherent modulation and demodulation. When the relays are under long-term po...
DAC
2006
ACM
14 years 8 months ago
2006
ACM
Three-dimensional (3-D) integrated circuits have emerged as promising candidates to overcome the interconnect bottlenecks of nanometer scale designs. While they offer several othe...
VLSID
2004
IEEE
14 years 7 months ago
2004
IEEE
With increasing demands for high performance by embedded systems, especially by digital signal processing applications, embedded processors must increase available instruction lev...
ISPD
2006
ACM
14 years 1 months ago
2006
ACM
The existing decoupling capacitance optimization approaches meet constraints on input impedance for package. In this paper, we show that using impedance as constraints leads to la...
TPDS
2008
13 years 7 months ago
2008
We study efficient interference-aware joint routing and TDMA link scheduling for a multihop wireless network to maximize its throughput. Efficient link scheduling can greatly reduc...