Certain manufacturing steps in very deep submicron VLSI involve chemical-mechanical polishing CMP which has varying e ects on device and interconnect features, depending on loca...
Andrew B. Kahng, Gabriel Robins, Anish Singh, Alex...
Chemical-mechanical polishing (CMP) and other manufacturing steps in very deep submicron VLSI have varying effects on device and interconnect features, depending on local character...
Yu Chen, Andrew B. Kahng, Gabriel Robins, Alexande...
To reduce manufacturing variation due to chemicalmechanical polishing and to improve yield, layout must be made uniform with respect to density criteria. This is achieved by layou...
Andrew B. Kahng, Gabriel Robins, Anish Singh, Alex...
In the nanometer IC design, dummy fill is often performed to improve layout pattern uniformity and the post-CMP quality. However, filling dummies might greatly increase intercon...
To successfully search multiple coadaptive subcomponents in a solution, we developed a novel cooperative evolutionary algorithm based on a new computational multilevel selection f...