With the growing complexity in consumer embedded products, new tendencies forecast heterogeneous Multi-Processor SystemsOn-Chip (MPSoCs) consisting of complex integrated component...
David Atienza, Federico Angiolini, Srinivasan Mura...
—In this paper, an energy-efficient and high performance ternary content addressable memory (TCAM) are presented. It employs the concept of “green” microarchitecture and circ...
Power gating has been widely used to reduce subthreshold leakage. However, its efficiency degrades very fast with technology scaling due to the gate leakage of circuits specific t...
Youngsoo Shin, Sewan Heo, Hyung-Ock Kim, Jung Yun ...
Three-dimensional integrated circuits (3D-ICs) are a promising approach to address the integration challenges faced by current systems on chips (SoCs). Designing an efficient netwo...
—Packet-switched interconnect fabric is a promising on-chip communication solution for many-core architectures. It offers high throughput and excellent scalability for on-chip da...
Zheng Li, Jie Wu, Li Shang, Robert P. Dick, Yihe S...