Power gating has been widely used to reduce subthreshold leakage. However, its efficiency degrades very fast with technology scaling due to the gate leakage of circuits specific to power gating, such as storage elements and output interface circuits with a data-retention capability. A new scheme called supply switching with ground collapse is proposed to control both gate and subthreshold leakage in nanometer-scale CMOS circuits. Compared to power gating, the leakage is cut by a factor of 6.3 with 65nm and 8.6 with 45nm technology. Various issues in implementing the proposed scheme using standardcell elements are addressed, from RTL to layout. The proposed design flow is demonstrated on a commercial design with 90nm technology, and the leakage saving by a factor of 32 is observed with 3% and 6% of increase in area and wirelength, respectively.