27 search results - page 2 / 6 » On interactions between routing and detailed placement |
ISPD
2012
ACM
12 years 3 months ago
2012
ACM
As technology scales and frequency increases, a new design style is emerging, referred to as hybrid designs, which contain a mixture of random logic and datapath standard cell com...
ISPASS
2009
IEEE
14 years 2 months ago
2009
IEEE
Until very recently, microprocessor designs were computation-centric. On-chip communication was frequently ignored. This was because of fast, single-cycle on-chip communication. T...
ISPD
2012
ACM
12 years 3 months ago
2012
ACM
We propose a new multilevel framework for large-scale placement called MAPLE that respects utilization constraints, handles movable macros and guides the transition between global...
DAC
2007
ACM
14 years 8 months ago
2007
ACM
Thermal problems and limitations on interlayer via densities are important design constraints on three-dimensional integrated circuits (3D ICs), and need to be considered during g...
ASPDAC
1998
ACM
13 years 11 months ago
1998
ACM
ABSTRACT - This paper presents a new design flow, FPDSiMPA, and a set of techniques for synthesizing high-performance sub-half micron logic circuits. FPD-SiMPA consists of logic p...