305 search results - page 45 / 61 » On modeling top-down VLSI design |
ISPD
2003
ACM
14 years 22 days ago
2003
ACM
The thermal problem has been emerged as one of the key issues for next-generation IC design. In this paper, we propose a scheme to achieve better thermal distribution for partitio...
VLSID
2005
IEEE
14 years 7 months ago
2005
IEEE
Abstract--Power analysis early in the design cycle is critical for the design of lowpower systems. With the move to system-level specifications and design methodologies, there has ...
DAC
2003
ACM
14 years 8 months ago
2003
ACM
Skin effect makes interconnect resistance and inductance frequency dependent. This paper addresses the problem of efficiently estimating the signal characteristics of any RLC netw...
VLSID
2008
IEEE
14 years 7 months ago
2008
IEEE
With increasing adoption of Electronic System Level (ESL) tools, effective design and validation time has reduced to a considerable extent. Cosimulation is found to be a principal...
ISLPED
2005
ACM
14 years 1 months ago
2005
ACM
This paper explores the power implications of replacing global chip wires with an on-chip network. We optimize network links by varying repeater spacing, link pipelining, and volt...