—Increasing power density causes die overheating due to limited cooling capacity of the package. Conventional thermal management techniques e.g. logic shutdown, clock gating, fre...
The paper presents a novel integrated system in which a number of image processing algorithm are embedded within a Genetic Algorithm (GA) based framework in order to provide an ad...
Syamsiah Mashohor, Jonathan R. Evans, Ahmet T. Erd...
As research begins to explore potential nanotechnologies for future post-CMOS integrated systems, modeling and simulation environments must be developed that can accommodate the c...
In this paper, we present a real-time PCB inspection system which can detect defects including the breaks in the wires and short circuit. The proposed inspection algorithm is based...
Kang-Sun Choi, Jae-Young Pyun, Nam-Hyeong Kim, Bye...
† This paper describes a novel methodology to automate the design of the interconnect distribution for multistage clock circuits. We introduce two key ideas. First, a hierarchica...