Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
In this paper, we study the problem of transfer learning from text to images in the context of network data in which link based bridges are available to transfer the knowledge bet...
Despite recent advances in uncovering the quantitative features of stationary human activity patterns, many applications, from pandemic prediction to emergency response, require a...
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
Abstract—Network-on-Chips (NoCs) paradigm is fast becoming a defacto standard for designing communication infrastructure for multicores with the dual goals of reducing power cons...
Dominic DiTomaso, Avinash Kodi, Savas Kaya, David ...