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ICCAD
2009
IEEE
136views Hardware» more  ICCAD 2009»
13 years 6 months ago
Multi-functional interconnect co-optimization for fast and reliable 3D stacked ICs
Heat removal and power delivery have become two major reliability concerns in 3D stacked IC technology. For thermal problem, two possible solutions exist: thermal-through-silicon-...
Young-Joon Lee, Rohan Goel, Sung Kyu Lim
WWW
2011
ACM
13 years 3 months ago
Towards semantic knowledge propagation from text corpus to web images
In this paper, we study the problem of transfer learning from text to images in the context of network data in which link based bridges are available to transfer the knowledge bet...
Guojun Qi, Charu C. Aggarwal, Thomas Huang
CORR
2011
Springer
195views Education» more  CORR 2011»
13 years 17 days ago
Collective response of human populations to large-scale emergencies
Despite recent advances in uncovering the quantitative features of stationary human activity patterns, many applications, from pandemic prediction to emergency response, require a...
James P. Bagrow, Dashun Wang, Albert-Lászl&...
DAC
2011
ACM
12 years 8 months ago
DRAIN: distributed recovery architecture for inaccessible nodes in multi-core chips
As transistor dimensions continue to scale deep into the nanometer regime, silicon reliability is becoming a chief concern. At the same time, transistor counts are scaling up, ena...
Andrew DeOrio, Konstantinos Aisopos, Valeria Berta...
HOTI
2011
IEEE
12 years 8 months ago
iWISE: Inter-router Wireless Scalable Express Channels for Network-on-Chips (NoCs) Architecture
Abstract—Network-on-Chips (NoCs) paradigm is fast becoming a defacto standard for designing communication infrastructure for multicores with the dual goals of reducing power cons...
Dominic DiTomaso, Avinash Kodi, Savas Kaya, David ...
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